Two-phase direct-to-chip cooling for high-density AI data centers
We’re building an advanced two-phase cooling platform to remove the thermal bottleneck from next-generation AI infrastructure — engineered loop architecture, heat captured at the source, no water at the rack.
Cooling is becoming the bottleneck
High-density GPU clusters are rapidly exceeding the practical limits of conventional air and single-phase water cooling. Rack power is rising faster than legacy thermal infrastructure can absorb, making cooling—not silicon—the limiting factor in what AI hardware can actually be deployed.
Two-phase Cooling Platform
Be one step ahead of rising AI rack density with our two-phase direct-to-chip cooling platform, designed to deploy and scale high-density data center infrastructure. By harnessing the exceptional heat-transfer performance of two-phase evaporation, our solution delivers dense, targeted cooling where processors need it most — enabling higher rack power density, lower circulating coolant volume, and a cleaner path to next-generation thermal design.
Cool the racks AI roadmaps are moving toward
Built for today’s racks and tomorrow’s density roadmap — scaling from current deployments toward 1 MW, and beyond without facility redesign.
Uniform chip temperatures, even under dynamic load
A shared saturation pressure sets one evaporation temperature across the loop, keeping junction temperatures consistent without per-rack flow balancing.
Built for long-term regulatory confidence
Engineered for long-term compliance — with no water required at the rack and none of the phase-out exposure now facing synthetic two-phase fluids.
Deploying high-density AI infrastructure?
We work with data-center operators and chip-platform teams on pilot deployments and thermal feasibility studies.